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JST PA 2.0 Connector Complete Guide: PAP, PASK, PASS & the KONNRA KR2014 Equivalent

Quick answer

A JST PA 2.0 connector is a single-row, 2.0 mm-pitch crimp wire-to-board family with secure locking, PAP housings, PASK DIP headers and PASS SMT headers. The standard PA family covers 2–16 circuits, 3 A at AWG #22, 250 V AC/DC and -40 °C to +105 °C. KONNRA KR2014 is a practical 2.0 mm alternative for many 2–15 circuit designs.

“JST PA 2.0” describes a family rather than one universal part. PAP-02V-S through PAP-15V-S are housing references; PASK identifies board headers and PASS identifies SMT variants. Pitch alone does not prove the same lock, footprint, terminal cavity or mating direction.

At a glance

Item JST PA family KONNRA KR2014
Pitch 2.0 mm 2.0 mm
Rows Single row Single row
Circuits 2–16 2–15 published range
Current 3 A at AWG #22 3 A
Voltage 250 V standard type 250 V
Temperature -40 °C to +105 °C -40 °C to +105 °C
Withstanding voltage 800 V AC/minute 800 V AC/minute
Insulation O.D. 0.76–1.50 mm 0.90–1.40 mm max
Board options DIP and SMT 90°/180° DIP and SMT

PAP, PASK and PASS cross-reference

PAP is the housing family. PASK identifies through-hole headers, including B02B-PASK and B02B-PASK-1. PASS identifies SMT headers, including SM02B-PASS and BM02B-PASS.

JST reference KONNRA KR2014 reference group
PAP-02V-S to PAP-15V-S H201401020101A to H201401150101A housings
B02B-PASK to B15B-PASK C2014RD right-angle DIP wafers
B02B-PASK-1 to B15B-PASK-1 C2014VD straight DIP wafers
SM02B-PASS to SM15B-PASS C2014RS right-angle SMT wafers
BM02B-PASS to BM15B-PASS C2014VS straight SMT wafers

See the KR2014 housing, terminal, DIP wafer and SMT wafer records.

What KR2014 publishes

KONNRA publishes KR2014 as a 2.0 mm wire-to-board series with 2–15 circuits, AWG #24–#28, 3 A current, 250 V voltage, -40 °C to +105 °C temperature, 20 mΩ maximum contact resistance, 1,000 MΩ minimum insulation resistance, 800 V AC/minute withstand voltage and tin plating over nickel. The public page lists Phosphor Bronze / PA66 / PA9T and 1.40 mm maximum insulation outside diameter.

What must be re-qualified

  • Footprint: 90° DIP, 180° DIP, 90° SMT and 180° SMT wafers have different holes, pads, heights and cable approaches.
  • Wire and crimp: KR2014 lists AWG #24–#28 and 0.90–1.40 mm insulation O.D.; AWG #22 designs need review.
  • Lock and keying: Confirm the actual mating pair with samples.
  • Circuit count: The current cross-list covers 2–15 circuits; a 16-position design needs formal review.

Application scenarios

Consumer electronics

The 2.0 mm pitch suits displays, chargers, appliances and compact control boards where serviceable cabling is needed in a narrow footprint.

Industrial controls and sensors

Single-row 2–15 circuit variants fit sensor harnesses, compact I/O boards and actuator modules. Validate vibration and terminal retention.

Automotive and mobility electronics

The -40 °C to +105 °C range is relevant to low-voltage vehicle electronics, instrument modules, charging accessories and battery auxiliaries. It does not by itself prove automotive qualification.

Power and renewable-energy controls

The published 3 A and 250 V envelope can suit monitoring, lighting, fan and auxiliary control circuits. Do not multiply 3 A by contact count without derating evidence.

Ten-point procurement checklist

  1. Record the exact PAP housing number.
  2. Confirm circuit count, including whether 16 positions are required.
  3. Identify PASK, PASS or another PA-family header.
  4. Match 90° DIP, 180° DIP, 90° SMT or 180° SMT geometry.
  5. Compare PCB holes, pads, height and keep-outs.
  6. Check conductor gauge and insulation O.D.
  7. Validate terminal crimp tooling and pull force.
  8. Confirm lock, polarisation and mismatch prevention with samples.
  9. Recheck current and voltage under real conditions.
  10. Release only after first-article fit, continuity, retention and environmental testing.

Frequently asked questions

Is KR2014 a JST PA 2.0 replacement?

KR2014 is a KONNRA 2.0 mm wire-to-board alternative positioned against the PA family. It is a family-level match for many 2–15 circuit assemblies, but the exact housing, terminal and wafer require qualification.

What is the KONNRA equivalent to PAP-02V-S?

The cross-list maps the 2-circuit housing to H201401020101A. Select the board wafer by orientation and circuit count.

Are S02B-PASK-2 and KR2014 wafers interchangeable without PCB changes?

Not automatically. Compare footprint, cable approach and solder geometry from the current drawings.

Does KR2014 support the same current and voltage as JST PA?

The published standard envelope is 3 A and 250 V. JST’s 3 A figure is tied to AWG #22, while KR2014 lists AWG #24–#28, so check the real wire and variant.

Can I mix a JST housing with a KR2014 wafer?

Do not assume mixed-vendor mating from the 2.0 mm pitch. Lock, polarisation, cavity tolerances and terminal position must be tested separately.

Where are the KR2014 drawings and specification?

Use the KR2014 product page, engineering drawing, PS-KR2014-01 specification and contact page.

Conclusion

The safe way to replace a JST PA 2.0 connector is to preserve the interface, not just the pitch. Start with PAP/PASK/PASS part numbers, map circuit count and board orientation to KR2014 component numbers, then verify wire, lock, footprint and environmental requirements with samples.