DIP Straight Wafer
DIP Straight Wafer
| Part Name | Wafer |
| Pitch | 2.0mm |
| Series | KR2014 |
| Compatible | B**B-PASK Series |
KR2014 VD Wafer
Features
| Product Type | Category | Wire to Board |
| Assembly Type | Wafer | |
| Pitch | 2.00mm | |
| Product Series | KR2014 Series | |
| Configuration Features | Number of Rows | 1 |
| Number of Positions | 2P~15P | |
| Electrical Characteristics | Operating Voltage （AC/DC) | 250V |
| Current(Max) | 3A | |
| Contact Resistance | 20mΩMax | |
| Insulation Resistance | 1000MΩMin | |
| Physical Characteristics | Housing Material | Nylon 9T,UL94V-0 |
| Color | Natural | |
| PIN Material | Brass | |
| PIN Plating | Tin over Nickel | |
| Wire/Cable Size (AWG) | 24# | |
| Operating Environment | Operating Temperature Range | -40℃~105℃ |
| Industry Standard | UL | E482542/LV 214 |