QZ000373 Series 0.8mm Pitch 24Pin FPC Connector

FPC connector, SMT Wafer single row.

Pitch 0.80mm
Circuits: 24pin
Current: 2A
Voltage: 100V

QZ000373 Series 0.8mm Pitch 24Pin FPC Connector

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General Specifaction

Material: Height Thermoplastic/UL94V-0/Phosphor Bronze/SUS
Withstanding Voltage: 100V AC/ minute
Temperature Range: -40℃~+105
Contact Resistance: 20mΩ/max
Insulation Resistance: 500MΩ/ min
Product Plating: Gold Flash Over Ni 30μ” Min

Overview

QZ000373 series FPC connectors are made of white thermoplastic shell with UL94V-0 flame retardant rating to ensure safety and durability. The contact material is phosphor bronze with at least 30μ” nickel undercoating and gold flash plating to ensure good conductivity and oxidation resistance. The pin and pad areas are tinned with at least 100μ” for easy SMD soldering.

Supports wide temperature range of -40°C to 105°C, suitable for various environments. Rated current of 2.0A, insulation resistance of up to 500 MΩ, and contact resistance as low as 20 mΩ ensure stable and reliable signal transmission. Connector size is 0.8mm pitch, 2.0mm height, perfect fit for compact space requirements.

Advantages

  • High quality materials

The housing is made of UL94V-0 rated white thermoplastic material with excellent flame retardant properties and high temperature resistance, ensuring the safety and reliability of the connector. At the same time, the contact material of phosphor bronze and the PEG material of SUS ensure good electrical conductivity and mechanical strength.

  • Excellent electrical properties

The contact area is plated with at least 30μ” nickel undercoating plus gold flash plating, which effectively prevents oxidation and reduces contact resistance (max. 20mΩ), ensuring efficient and stable signal transmission. In addition, high insulation resistance (min. 500MΩ) and voltage withstand capability (250V AC/min) further enhance the safety and reliability of electrical performance.

  • Wide Temperature Range

Supports wide temperature operation from -40°C to 105°C, adapting to a variety of extreme environmental conditions and ensuring the stability and reliability of the connector in various application scenarios.

  • Good solderability and durability

Both SMD area and PEG are tinned with at least 100μ”, which improves solderability and durability, and reduces the defective rate during the soldering process.