Straight Wafer
Straight Wafer
Part Name | Wafer |
Pitch | 2.00mm |
Series | KR2009 |
Compatible | DF3 Series |
2009 dip180
Features
Product Type | Category | Wire to Board |
Assembly Type | Wafer | |
Pitch | 2.0mm | |
Product Series | KR2009 Series | |
Configuration Features | Number of Rows | 1 |
Number of Positions | 2P~15P | |
Electrical Characteristics | Operating Voltage (AC/DC) | 250V |
Current(Max) | 3A | |
Contact Resistance | 30mΩ Max | |
Insulation Resistance | 1000MΩ Min | |
Physical Characteristics | Housing Material | PA6T UL94 V-0 |
Color | Black | |
PIN Material | Brass | |
PIN Plating | Gold flash over Nickel | |
Wire/Cable Size (AWG) | 22#-28# | |
Operating Environment | Operating Temperature Range | -40℃~105℃ |
Industry Standard | UL | E482542 |