Straight Wafer

Part Name Wafer
Pitch 2.00mm
Series KR2008
Compatible AMP Series

2008 dip180

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Features

Product Type Category Wire to Board
Assembly Type Wafer
Pitch 2.00mm
Product Series KR2008 Series
Configuration Features Number of Rows 1
Number of Positions 2P~15P
Electrical Characteristics Operating Voltage(AC/DC) 125V
Current(Max) 3A
Contact Resistance 20mΩ Max
Insulation Resistance 1000MΩ Min
Physical Characteristics Housing Material PA66 UL94 V-0
Color White
PIN Material Brass
PIN Plating Tin over Nickel
Wire/Cable Size (AWG) 22#-26#
Operating Environment Operating Temperature Range -40℃~105℃
Industry Standard UL E482542