KR2541 Wire to Board Series

SL connector, DIP/SMT wafer, with its large number of options and configurations, SL Modular Connectors and Assemblies deliver ideal wire-to-wire solutions and its varying PCB termination methods, including reflow process capable versions, support a range of wire-to-board applications.

Pitch 2.54mm
Circuits: 2-20pin
Current: 3A
Voltage: 250V

 

KR2541 Wire to Board Series

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General Specifaction

Material: PA66/PA9T/UL94/Phosphor Bronze/Brass
Insulation O.D 2.54mm
Withstanding Voltage: 1000V AC/ minute
Temperature Range: -40℃~+105℃
Contact Resistance: 20m Q/max
Insulation Resistance: 1000MQ/ min
Product Plating Tin/Gold Flash over Nickel

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