KR2527 Series Single Row Wire to Board Card Edge Connectors

Circuits & Dimensions (Part No. C2527F Series, Drawing No. 2527WFRD Series)

* Designed for 1.50 ± 0.14 mm PCB edge card thickness. Continuous chained packaging (50 pcs/chain, 50 × Y ≈ 465mm) for automated high-speed wire harness press termination.

Overview

The KONNRA KR2527 series is a next-generation 2.50 mm pitch RAST 2.5 card edge connector featuring advanced Insulation Displacement Connection (IDC) technology. Built in accordance with the European RAST 2.5 (Raster Appliance Software Technology) industry standard, the KR2527 connects directly onto the edge contact pads of standard 1.50 mm (±0.14 mm) printed circuit boards without requiring a mating pin header or surface-mount wafer on the PCB.

Engineered for high-volume, automated wire harness manufacturing in the home appliance and automotive electronics industries, the KR2527 features precision IDC bifurcated contact blades that pierce conductor insulation cleanly during automated pressing, creating a gas-tight, oxidation-free metallurgical connection without pre-stripping. Supplied in linked chain/strip formats (50 pieces per chain), the connector integrates seamlessly with high-speed automatic harness processing machines. With a low mated profile of just 11.0 mm after pressing, integrated dual-side LR locking latches, and standardized coding keys (Key1 through Key8), the KR2527 provides 100% anti-mismating assurance, maximum space efficiency, and dramatic reductions in total assembly time and BOM costs.

Key Advantages of KR2527 Series

• High-Efficiency IDC Termination (Stripping-Free Automated Processing): Eliminates manual wire cutting and stripping. Discretely insulated wires are pressed directly into contact slots, forming reliable gas-tight contacts. Continuous chain packaging (50 pcs/chain) supports automated harness assembly machines, achieving up to 3x higher production efficiency than traditional crimp-and-poke connectors.
• Direct-to-PCB Card Edge Mating (Zero Pin Header BOM): Plugs directly onto 1.50mm (±0.14mm) PCB edge contact fingers, completely removing PCB pin headers and associated wave soldering or SMT processes, reducing total interconnect system costs by up to 35%.
• Ultra-Low Profile Post-Press Form Factor: Pre-press height is 13.50 mm, compressing to only 11.00 mm after automated wire insertion, providing exceptional vertical clearance in slim home appliances and compact automotive electronics.
• Standardized RAST 2.5 Mechanical Keying & LR Latches: Standardized polarization ribs and coding keys (Key1, Key2, Key3, Key4, Key8) combined with integrated Left-Right (LR) locking latches eliminate mismating errors and guarantee secure board retention under continuous vibration.
• Glow-Wire & High-Temperature Safety (IEC 60335-1 / UL 94V-0): Constructed with high-performance thermoplastic rated UL 94V-0 and certified to meet Glow Wire Flammability Index (GWFI) requirements per IEC 60335-1, ensuring safe unattended operation across an operating temperature range of -40°C to +125°C.
• Low Contact Resistance & High Dielectric Strength: High-conductivity copper alloy contacts with bright tin-over-nickel plating maintain an ultra-low contact resistance (≤10mΩ Max.) and withstand 1000V AC dielectric test for 1 minute.