KR2013 Series
DIP Wafer, dual row, board to board connector
| Pitch | 2.00mm |
| Circuits: | 2*3-2*25pin |
| Current: | 1.5A |
| Mating Height: | 6.40 |
KR2013 Series
Product Introducing
Select Components
Download
General Specifaction
| Material: | LCP/UL94/Brass |
| Withstanding Voltage: | 500V AC/ minute |
| Temperature Range: | -40℃～+105℃ |
| Contact Resistance: | 20mΩ/max |
| Insulation Resistance: | 1000MΩ/ min |
| Product Plating: | Gold flash over Nickel |