DIP Dual Row Right Wafer
DIP Dual Row Right Wafer
| Part Name | Wafer |
| Pitch | 3.0mm |
| Series | KR3000 |
| Compatible | 43045 Series |
MX3.0 RD Dual (TAB)
Features
| Product Type | Category | Wire to Board |
| Assembly Type | Wafer | |
| Pitch | 3.00mm | |
| Product Series | KR3000 Series | |
| Configuration Features | Number of Rows | 2 |
| Number of Positions | 2*1P~2*12P | |
| Electrical Characteristics | Operating Voltage （AC/DC) | 250V |
| Current(Max) | 5A | |
| Contact Resistance | 10mΩMax | |
| Insulation Resistance | 1000MΩMin | |
| Physical Characteristics | Housing Material | LCP,UL94V-0 |
| Color | Black | |
| PIN Material | Plated Over Nickel | |
| PIN Plating | Tin Over Nickel | |
| Wire/Cable Size (AWG) | 20#-24# | |
| Operating Environment | Operating Temperature Range | -40℃~105℃ |
| Industry Standard | UL | E482542 |