DIP Right Angle Wafer
DIP Right Angle Wafer
| Part Name | Wafer |
| Orientation | Right Angle |
| Pitch | 2.54mm |
| Series | KR2555 |
KR2555 Series DIP Right Angle Wafer
Features
| Product Type | Category | Wire to Board |
| Assembly Type | Wafer | |
| Pitch | 2.54mm | |
| Product Series | KR2555 Series | |
| Configuration Features | Number of Rows | 1 |
| Number of Positions | 2P | |
| Electrical Characteristics | Operating Voltage （AC/DC) | 250V |
| Current(Max) | 3A | |
| Contact Resistance | 10mΩ Max | |
| Insulation Resistance | 1000MΩ Min | |
| Physical Characteristics | Insulator Material | PA9T UL 94V-0 |
| Color | Black | |
| Contact Material | C2680-EH | |
| Plating | Bright Tin plated over Nickel | |
| Operating Environment | Environmental requirement: | 280℃±5℃ for 5 seconds |
| Industry Standard | UL | E482542 |