| Product Type |
Category |
Wire to Board |
| Assembly Type |
Wafer |
| Pitch |
1.00mm |
| Product Series |
KR1007 Series |
| Configuration Features |
Number of Rows |
2 |
| Number of Positions |
2*3P~2*25P |
| Electrical Characteristics |
Operating Voltage （AC/DC) |
50V |
| Current(Max) |
1A |
| Contact Resistance |
55mΩ Max |
| Insulation Resistance |
500MΩ Min |
| Physical Characteristics |
Housing Material |
LCP UL94 V-0 |
| Color |
Beige |
| PIN Material |
Copper alloy |
| PIN Plating |
Gold flash/Tin over Nickel |
| Wire/Cable Size (AWG) |
28#-32# |
| Operating Environment |
Operating Temperature Range |
-40℃~105℃ |
| Industry Standard |
UL |
E482542 |
