DIP Single Row Straight Wafer

DIP Single Row Straight Wafer

Pitch 3.0mm
Circuits: 2-12pin
Current: 5A
Voltage: 250V

MX3.0 VD Single


    Features

    Product Type Category Wire to Board
    Assembly Type Wafer
    Pitch 3.00mm
    Product Series KR3000 Series
    Configuration Features Number of Rows 1
    Number of Positions 2P~12P
    Electrical Characteristics Operating Voltage (AC/DC) 250V
    Current(Max) 5A
    Contact Resistance 10mΩMax
    Insulation Resistance 1000MΩMin
    Physical Characteristics Housing Material Nylon 9T,UL94V-0
    Color Black
    PIN Material Brass
    PIN Plating Tin over Nickel
    Wire/Cable Size (AWG) 20#-24#
    Operating Environment Operating Temperature Range -40℃~105℃
    Industry Standard UL E482542