DIP Right Angle Wafer

DIP Right Angle Wafer

Part Name Wafer
Pitch 2.0mm
Series KR2014
Compatible S**B PASK Series

KR2014 RD Wafer

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Features

Product Type Category Wire to Board
Assembly Type Wafer
Pitch 2.00mm
Product Series KR2014 Series
Configuration Features Number of Rows 1
Number of Positions 2P~15P
Electrical Characteristics Operating Voltage (AC/DC) 250V
Current(Max) 3A
Contact Resistance 20mΩMax
Insulation Resistance 1000MΩMin
Physical Characteristics Housing Material Nylon 9T,UL94V-0
Color Natural
PIN Material Brass
PIN Plating Tin over Nickel
Wire/Cable Size (AWG) 24#
Operating Environment Operating Temperature Range -40℃~105℃
Industry Standard UL E482542/LV 214