DIP Straight Wafer

Part Name Wafer
Pitch 1.25mm
Series KR1250
Compatible 53047 Series

1250DIP straight wafer


    Features

    Product Type Category Wire to Board
    Assembly Type Wafer
    Pitch 1.25mm
    Product Series KR1250 Series
    Configuration Features Number of Rows 1
    Number of Positions 2P~16P
    Electrical Characteristics Operating Voltage(AC/DC) 125V
    Current(Max) 1A
    Contact Resistance 20mΩ Max
    Insulation Resistance 100MΩ Min
    Physical Characteristics Housing Material PA46 PA9T LCP UL94 V-0
    Color Beige
    PIN Material Brass
    PIN Plating  Tin over Nickel
    Wire/Cable Size (AWG) 28#-32#
    Operating Environment Operating Temperature Range -40℃~105℃
    Industry Standard UL E482542