DIP Right Angle Wafer
DIP Right Angle Wafer
| Part Name | Wafer |
| Pitch | 2.50mm |
| Series | KR2502 |
| Compatible | YH Series |
2502 DIP90
Features
| Product Type | Category | Wire to Board |
| Assembly Type | Wafer | |
| Pitch | 2.50mm | |
| Product Series | KR2502 Series | |
| Configuration Features | Number of Rows | 1 |
| Number of Positions | 2P~18P | |
| Electrical Characteristics | Operating Voltage （AC/DC) | 250V |
| Current(Max) | 3A | |
| Contact Resistance | 20mΩ Max | |
| Insulation Resistance | 100MΩ Min | |
| Physical Characteristics | Housing Material | PA66 UL94 V-0 V-2 |
| Color | White | |
| PIN Material | Brass | |
| PIN Plating | Tin over Nickel | |
| Wire/Cable Size (AWG) | 28#-22# | |
| Operating Environment | Operating Temperature Range | -40℃~105℃ |
| Industry Standard | UL | E482542 |