Right Angle Wafer
Right Angle Wafer
Part Name | Wafer |
Pitch | 2.00mm |
Series | KR2013 |
Mating Height | 6.40 |
2013 W
Features
Product Type | Category | Board to Board |
Assembly Type | Wafer | |
Pitch | 2.00mm | |
Product Series | KR2013 Series | |
Configuration Features | Number of Rows | 2 |
Number of Positions | 2*3P~2*25P | |
Electrical Characteristics | Operating Voltage (AC/DC) | 250V |
Current(Max) | 1.5A | |
Contact Resistance | 20mΩ Max | |
Insulation Resistance | 1000MΩ Min | |
Physical Characteristics | Housing Material | LCP UL94 V-0 |
Color | Black | |
PIN Material | Brass | |
PIN Plating | Gold Flash over Nickel | |
Operating Environment | Operating Temperature Range | -40℃~105℃ |
Industry Standard | UL | E482542 |