DIP Straight Wafer
DIP Straight Wafer
| Part Name | Wafer |
| Pitch | 1.50mm |
| Series | KR1501 |
| Compatible | ZH Series |
1501 dip180
Features
| Product Type | Category | Wire to Board |
| Assembly Type | Wafer | |
| Pitch | 1.50mm | |
| Product Series | KR1501 Series | |
| Configuration Features | Number of Rows | 1 |
| Number of Positions | 2P~13P | |
| Electrical Characteristics | Operating Voltage （AC/DC) | 100V |
| Current(Max) | 1A | |
| Contact Resistance | 20mΩ Max | |
| Insulation Resistance | 500MΩ Min | |
| Physical Characteristics | Housing Material | PA66 UL94 V-0 |
| Color | Grey | |
| PIN Material | Brass | |
| PIN Plating | Tin over Nickel | |
| Wire/Cable Size (AWG) | 26#-30# | |
| Operating Environment | Operating Temperature Range | -40℃~105℃ |
| Industry Standard | UL | E482542 |