DIP Single Row Right Angle Wafer

DIP Single Row Right Angle Wafer

Part Name Wafer
Pitch 1.25mm
Series KR1256
Compatible DF13 Series

1256 DIP90

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Features

Product Type Category Wire to Board
Assembly Type Wafer
Pitch 1.25mm
Product Series KR1256 Series
Configuration Features Number of Rows 1
Number of Positions 2P~15P
Electrical Characteristics Operating Voltage(AC/DC) 150V
Current(Max) 1A
Contact Resistance 30mΩ Max
Insulation Resistance 500MΩ Min
Physical Characteristics Housing Material PA66 UL94 V-0
Color Grey
PIN Material Brass
PIN Plating Tin over Nickel
Wire/Cable Size (AWG) 28#-32#
Operating Environment Operating Temperature Range -40℃~105℃
Industry Standard UL E482542